Muegge Products

Plasma components

Show all
No results found
Show all
Radical plasma source (Remote Plasma Source) (37)
Plasma array (large area) (9)
Atmospheric-Plasma-Source (2)
Down-Streem-Plasma-Source (2)
Show all
No results found
Show all
Etching & Deposition (46)
Gas- /Material Transformation (4)
Show all
No results found
Show all
2000 (21)
3000 (20)
2x 3000 (3)
10000 (1)
100000 (1)
1250 (1)
2x 2000 (1)
6000 (1)
75000 (1)
Show all
No results found
Show all
Plasma area 320 mm x 320 mm (5)
others (4)
Plasma area 338 mm x 408 mm (1)
Plasma area 520 mm x 340 mm (1)
Plasma area 700 mm x 226 mm (1)
Plasma area 797,5 mm x 150 mm (1)
Show all
No results found
Show all
Ceramics (31)
Sapphire (15)
- (2)
Quartz (2)
Show all
No results found
Show all
2450 (47)
915 (3)
Show all
No results found
Show all
230 / 208 (37)
– (11)
Show all
No results found
Show all
Coaxial (3)
WR975 / R9 (3)
WR340 / R26 (1)
50 Products in
Plasma components
  • Plasma array (large area)

    Item number: MA4000Y-123BC

    Process
    Etching & Deposition
    Output Connection Type
    Plasma area 320 mm x 320 mm
    Dielectric material
    Ceramics
    Output Power CW [W]
    2000
    Frequency [MHz]
    2450
    Gas manifold
    Single

    Flächenplasmaquelle

  • Plasma array (large area)

    Item number: MA4000Y-153BC

    Process
    Etching & Deposition
    Output Connection Type
    Plasma area 320 mm x 320 mm
    Dielectric material
    Ceramics
    Output Power CW [W]
    2000
    Frequency [MHz]
    2450
    Gas manifold
    Double

    Flächenplasmaquelle

  • Plasma array (large area)

    Item number: MA6000Y-013BC

    Process
    Etching & Deposition
    Output Connection Type
    Plasma area 700 mm x 226 mm
    Dielectric material
    Ceramics
    Output Power CW [W]
    2x 3000
    Frequency [MHz]
    2450
    Gas manifold
    Double

    Flächenplasmaquelle

  • Plasma array (large area)

    Item number: MA6000Y-023BC

    Process
    Etching & Deposition
    Output Connection Type
    Plasma area 797,5 mm x 150 mm
    Dielectric material
    Ceramics
    Output Power CW [W]
    2x 3000
    Frequency [MHz]
    2450
    Gas manifold
    Double

    Flächenplasmaquelle

  • Plasma array (large area)

    Item number: MA6000Y-033BC

    Process
    Etching & Deposition
    Output Connection Type
    Plasma area 520 mm x 340 mm
    Dielectric material
    Ceramics
    Output Power CW [W]
    2x 3000
    Frequency [MHz]
    2450
    Gas manifold
    Double

    Flächenplasmaquelle

  • Radical plasma source (Remote Plasma Source)

    Item number: MA1250C-003BC

    Process
    Etching & Deposition
    Output Connection Type
    Dielectric material
    Ceramics
    Mains voltage nominal [V]
    230 / 208
    Output Power CW [W]
    1250
    Frequency [MHz]
    2450

    Radikalquelle (Remote-Plasma-Quelle)

  • Radical plasma source (Remote Plasma Source)

    Item number: MA2000C-083BB

    Process
    Etching & Deposition
    Output Connection Type
    Dielectric material
    Ceramics
    Mains voltage nominal [V]
    230 / 208
    Output Power CW [W]
    2000
    Frequency [MHz]
    2450

    Radikalquelle (Remote-Plasma-Quelle)

  • Radical plasma source (Remote Plasma Source)

    Item number: MA2000C-123BB

    Process
    Etching & Deposition
    Output Connection Type
    Dielectric material
    Ceramics
    Mains voltage nominal [V]
    230 / 208
    Output Power CW [W]
    2000
    Frequency [MHz]
    2450

    Radikalquelle (Remote-Plasma-Quelle)

PLASMA COMPONENTS

Semiconductor technology has changed our view of the world – but plasma processing has made it possible to produce products for everyone. High-density microwave-assisted plasma sources perform superiorly in etching and deposition systems that require high etching rates without electrical charging or damage to the material.

.

Our leading role as a manufacturer of plasma components helps you to develop and adapt your systems – while ensuring fast market entry and low CoO. As part of our “”turnkey”” product range, we offer plasma components for a variety of different production tools and applications:

.

    • High density deposition of oxide and nitride layers

 

  • SU-8 distance
  • Highly selective removal of organic materials
  • Non-oxidizing chemistry for cleaning of oxygen sensitive materials
  • Damage-free cleaning of sensitive surfaces (e.g. sensors) and 3D structures
  • Isotropic chamber cleaning
  • LIGA process (lithography, electroplating and shaping)